晶片型二極體
晶片型二極體封裝優勢:
Chip form Pin to Pin全系列，對應SMA/B/C 及SOD全系列.
Leadless construction貼板使用更可安全.
No wire bonding全球最低薄封裝低感抗.
High thermal dissipation.
Halogen Free.
RoHS Compliant.
更佳的焊接特性與更強大的可靠度信賴性.
Chip form Pin to Pin全系列，對應SMA/B/C 及SOD全系列.
Leadless construction貼板使用更可安全.
No wire bonding全球最低薄封裝低感抗.
High thermal dissipation.
Halogen Free.
RoHS Compliant.
更佳的焊接特性與更強大的可靠度信賴性.
Low VF/IR Rectifier with GPRC Technology:
Passivation of p-n Junction -- Fully glass passivation.
Electrical Performance -- Higher Operation 175°C.
Electrical Performance -- Higher Reverse Operating High Voltage.
Reliability -- Low H.T.I.R under 20uA(H.T.I.R date measured for GP20G at Ta=150°C).
Reliability -- Better H.T.R.B Better than GPP.
